回顧蝕刻設備的發展，最早僅是一個蝕刻液槽或缸，存放了蝕刻液，覆銅板掛浸在里面溶液中去除未保護的銅; 后又使蝕刻液攪動或板子擺動，稍微提高蝕刻速度。此后，在蝕刻液槽中間有一根噴管，板子豎直放于槽體周圍，噴管旋轉的離心力把溶液飛濺于板面上實現蝕刻銅。由于板子固定放置于槽內，人工放板與取板效率低，且勞動強度大。這種條件下加工的板子線條寬度/間距在0.5mm以上。
Reviewing the development of etching equipment, it was only an etching tank or cylinder that stored the etching solution, and the copper clad laminate was hung and immersed in the solution to remove unprotected copper; After that, the etching solution is stirred or the plate is swung to slightly improve the etching speed. After that, there is a nozzle in the middle of the etching liquid tank, and the plate is placed vertically around the tank. The centrifugal force of the nozzle rotation splashes the solution on the plate to realize copper etching. Because the board is fixed in the slot, the manual placing and taking of the board is inefficient and labor-intensive. The width / spacing of board lines processed under this condition is more than 0.5mm.
